An inseparable part of our discipline also includes programming chips (microcontrollers) and their use in the control, communication and processing of data. Wireless technologies, such as Bluetooth, ZigBee and others are another essential area of research. We are also engaged in opto-electronics, in particular data transfer and transfer routes.
We offer the following:
- Design, development and delivery of manufactured samples of customer integrated circuits
- Encapsulation of chips
- Design and manufacture of hybrid integrated circuits and all the technological background
- Design and manufacture of sensors (in particular pressure sensors, biosensors and chemosensors) using nanotechnologies
- Design, development and delivery of functional prototypes of various embedded systems, including programming the control, communication and processing of data, also for wireless applications and mobile devices
- Design and development of data transfer along optical routes
- Pyrolytic steaming, plasma etching and stripping, chemical etching of Si, anodic bonding of Si/SiO2 bands, laser cutting and Al bonding is available and so are Au wires with a diameter of 25 µm and complete thick-layer technology, including an option to fit printed circuits with SMD
- Contacting semiconductor chips and other microelectronic structures with Au and AlSi wire of 0.025mm diameter using ultrasonic, thermocompression, and the thermosonic bonding (both ball and wedge)
- Educational seminars for both the academic and business sectors.
Special instrumentation:
- Bioelectrochemical and chemical worksite for material synthesis, equipped with a glove box for working in inert atmosphere and an adapted microwave chamber for preparation of nanoparticles
- Instrument AGILENT 4284A for impedance spectroscopy
- VOLTALAB 50 and PALMSENS, CH-INSTRUMENTS, AUTOLAB, VA Computing
- Cleanrooms with a biohazard box and culturing equipment (shakers, incubators) for biological experiments
- MIRA LMU scanning electron microscope with the option of nanolithography in the near field
- Spin-coater
- Hot plate for hardening resists with UV exposure
- Controlled unit for measuring in flowing gas
- An AGILENT worksite and automated unit for post-process modification of chip surfaces on non-cut wafers (electro) using chemical methods.
- Contacting device for TPT and DB chips, Dresden (wire bonder)
- DAGE testing device (shear and tensile strength of connection)
- Ersascope inspection camera (monitoring BGA and Flip chip)
- Ftitsch fitting equipment (for BGA and Flip chip)
- U 1202 viscozimeter
- BTU sintering furnace (up to 1000 °C)
- Laser YAG – Aurel
- Ascon soldering device in vapours
- HR-65 infra soldering oven (including nitrogen atmosphere)
- Ersa IR-400 service station
- 3D Lynx microscope with digital record
References:
- ON Semiconductor
- STMicroelectronics
- National Semiconductor
- Honeywell
- Infineon
- Philips
- IBM
- MOTOROLA
- Microchip
- Autocont
- Texas Instruments
- ASICentrum
- BD Sensors
- microFAB
- BVT Technologies
